| 摘要 |
PURPOSE: A wafer rotating apparatus of an RTP(Rapid Thermal Processing) chamber is provided to be capable of improving the uniformity of a wafer and minimizing wafer defects. CONSTITUTION: A wafer rotating apparatus of an RTP chamber is provided with a rotation assembly(200) for loading and supporting a wafer and a rotation bearing(300) between the lower portion of the rotation assembly and the lower body part of the RTP chamber for rotating the rotation assembly. At this time, the rotation assembly has a gear ring. The wafer rotating apparatus further includes a driving gear(400) connected to one side of the gear ring, a driving shaft(500) connected to the driving gear and located through the lower body part of the RTP chamber, a sealing tube(600) fixed to the predetermined portion of the resultant structure for sealing the lower body part of the RTP chamber, and a motor(700) mechanically connected to the driving shaft.
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