发明名称 SILICON OPTICAL BENCH FOR PACKAGING OF OPTICAL SWITCH DEVICE, OPTICAL SWITCH PACKAGE USING THE SAME, MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A silicon optical bench for the packaging of an optical switch device, an optical switch package using the same, a manufacturing method thereof are provided to be capable of exactly carrying out an aligning process between the optical switch device, a light input part, and a light output part. CONSTITUTION: A silicon optical bench(100) includes a silicon substrate(110). At this time, the silicon substrate includes the first region for loading an optical switch device, the second region located at the first side of the first region for forming a light input part, and the third region located at the second side of the first region for forming a light output part. A vacant space(120) is formed through the silicon substrate at the first region. A plurality of grooves(131,132,133) formed on the silicon substrate at the second and third region for loading a lens and an optical fiber.
申请公布号 KR20040034175(A) 申请公布日期 2004.04.28
申请号 KR20020064259 申请日期 2002.10.21
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 CHOI, BYEONG SEOK;EOM, YONG SEONG;LEE, JONG HYEON;PARK, HEUNG U;YOON, HO GYEONG
分类号 H01L31/12;G02B6/35;G02B6/36;(IPC1-7):H01L31/12 主分类号 H01L31/12
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