发明名称 |
SEMICONDUCTOR DEVICE POWER INTERCONNECT STRIPING |
摘要 |
A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path. |
申请公布号 |
AU2003272621(A1) |
申请公布日期 |
2004.04.23 |
申请号 |
AU20030272621 |
申请日期 |
2003.09.19 |
申请人 |
INTEL CORPORATION |
发明人 |
EDWARD OSBURN;ERIK PETER;TIMOTHY GATES |
分类号 |
H01L23/498;H01L23/50;H05K1/02;H05K1/11;H05K3/42;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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