发明名称 SEMICONDUCTOR DEVICE POWER INTERCONNECT STRIPING
摘要 A method and an apparatus for improving the delivery and filtering of power to a semiconductor device is disclosed by organizing out interconnects (pins, balls, pads or other interconnects) used to carry power in a striped configuration that shortens the conductive path required between a power source and a semiconductor device and that reduces the resistance of that conductive path.
申请公布号 AU2003272621(A1) 申请公布日期 2004.04.23
申请号 AU20030272621 申请日期 2003.09.19
申请人 INTEL CORPORATION 发明人 EDWARD OSBURN;ERIK PETER;TIMOTHY GATES
分类号 H01L23/498;H01L23/50;H05K1/02;H05K1/11;H05K3/42;(IPC1-7):H01L23/50 主分类号 H01L23/498
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