发明名称 Etching method and apparatus
摘要 The invention intends to provide an etching method in which a bank 12 is formed to a member to be processed 10, and thereby a precise etching can be applied to a predetermined position, and apparatus for the method. In a range outside of a predetermined pattern of the member to be processed 10, a liquid repelling bank 12 is formed, and by use of a discharge head 16 a coating liquid 14 such as an etching liquid 15 is coated on an etching portion 18 of the predetermined pattern. The etching portion 18 is rendered lyophilic by treatment to improve the fixing properties of the coating liquid 14, and the bank 12 is formed of a liquid repelling film, and thereby the coating liquid 14 is inhibited from adhering to the bank 12.
申请公布号 US2004074870(A1) 申请公布日期 2004.04.22
申请号 US20030359115 申请日期 2003.02.06
申请人 SEIKO EPSON CORPORATION 发明人 KOIKE TAKASHI;MORI YOSHIAKI
分类号 C23F1/02;C23F1/12;H01L21/306;(IPC1-7):C23F1/00 主分类号 C23F1/02
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