发明名称 |
Plating uniformity control by contact ring shaping |
摘要 |
An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.
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申请公布号 |
US2004074761(A1) |
申请公布日期 |
2004.04.22 |
申请号 |
US20020278527 |
申请日期 |
2002.10.22 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HERCHEN HARALD;HAO HENAN;ESTEBAN CELINA M.;WEBB TIMOTHY R.;TRINH SON N. |
分类号 |
C25D7/12;C25D17/06;H01L21/288;(IPC1-7):H05F3/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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