| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device capable of improving cooling efficiency inside a casing without blocking cost reduction and compaction. <P>SOLUTION: The electronic device is provided with a plurality of substrates 21-24 loaded with electronic components; a power source 31 and an extension card 32 to be high load components accompanied by heat generation; and the casing 10 for housing the substrates 21-24, the power source 31 and the extension card 32. Roughly horizontally arranged first substrate 21, third substrate 23 and fifth substrate 25, and a second substrate 22 roughly vertically arranged with a clearance in a horizontal direction from the substrates are equipped, the power source 31 and the extension card 32 are arranged below the clearance in the horizontal direction, and a discharge port 17 is arranged above the clearance in the horizontal direction. <P>COPYRIGHT: (C)2004,JPO</p> |
