| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for producing the elemental board of a multilayer board and a method for producing the multilayer board in which separation of conductive paste from a via hole can be prevented when a protective film is stripped. <P>SOLUTION: After a protective film 81 is pasted to a single-sided conductor pattern film 21 (shown in Fig. (b)), a via hole 24 is bored (shown in Fig. (c)). The via hole 24 is filled with conductive paste 50a (shown in Fig. (d)), and then filled with conductive paste 50b containing a high boiling point solvent (shown in Fig. (e)). Before the high boiling point solvent dries up, the protective film 81 is stripped (shown in Fig. (f)). Finally, the single-sided conductor pattern film 21 is laminated and hot pressed under vacuum thus obtaining a multilayer board. <P>COPYRIGHT: (C)2004,JPO</p> |
