| 摘要 |
PROBLEM TO BE SOLVED: To judge whether a semiconductor integrated circuit device is to go or not to go by detecting partial cut (uncut) of a fuse in the device. SOLUTION: A fuse forming region is provided in a peripheral circuit region within a chip region on a semiconductor substrate and a second layer interconnect line M2 becoming a fuse and a TEG fuse Ft is formed. A plurality of TEG fuses Ft are connected in parallel between the exposed parts of a third layer interconnect line M3, i.e. pad parts Pa and Pb. In a first inspection (P1 inspection), various circuits (peripheral circuits) required for driving a memory cell are tested, e.g. an internal voltage generating circuit is tested for desired operation. If regulation of an output voltage is required, a fuse is cut appropriately and after the output voltage is regulated, a potential is applied across a TEG fuse Ft, which was cut under conditions substantially identical to the cutting conditions of that fuse, through the pad parts Pa and Pb and then a decision is made electrically whether the TEG fuse Ft has been cut or not. If an uncut fuse is present, that chip is judged rejectable. COPYRIGHT: (C)2004,JPO
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