Mounting device for monolithic integrated circuits for use in motor vehicles which are subject to wide fluctuations in operating temperature have platform raised above substrate for connection area for bondable contacts

摘要

The mounting device (substrate) (1) for the integrated circuit is provided with a raised platform (2) which forms the connection area for bondable contacts. This platform is raised compared to a chip contact area on the substrate. It has steep flanks (3) with a ratio of the flank height (hp) to substrate height (h) of between 1/5 t0 2/1.