发明名称 |
Semiconductor package device testing apparatus |
摘要 |
A semiconductor package device testing apparatus includes a conductive component, a first main body, a second main body, a pressing member, and a heating component. The conductive component has a plurality of conductive portions electrically connect with the pins of the semiconductor package device and disposed at one side of the first main body. The second main body is disposed at the other side of the first main body. In addition, the first main body has a first opening to define a space for receiving the semiconductor package device. The semiconductor package device is disposed within the first opening by the pressing member. The pressing member connects to the second main body through a second opening of the second main body. The heating component mounts on the first main body to heat the semiconductor package device.
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申请公布号 |
US2004075091(A1) |
申请公布日期 |
2004.04.22 |
申请号 |
US20020321367 |
申请日期 |
2002.12.18 |
申请人 |
HUANG CHING-JUNG;CHOU HSIU-CHU;LIAO MU-SHENG;YU CHENG-JI;HONG KUO-HSIUNG |
发明人 |
HUANG CHING-JUNG;CHOU HSIU-CHU;LIAO MU-SHENG;YU CHENG-JI;HONG KUO-HSIUNG |
分类号 |
G01R1/04;G01R31/316;(IPC1-7):H01L23/58 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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