A multi-axis projection imaging system. Such a system includes a plurality of objectives (134a) defining respective object fields of view and corresponding image fields of view. An object (0) is adapted for controllably illuminating the object fields of view with light that varies spatially in one or more selected characteristics, for creating respective images within the image fields of view. A preferred use of the present invention is in standard photolithographic manufacturing of an integrated circuit, where a semiconductor wafer device Ob includes a layer 136 of photoresist. Light produced by the object 128 is imaged onto the photoresist to expose the photoresist according to a defined pattern of circuit features known as a "mask" in the art of integrated circuit manufacture. However, it should be understood that the light may be imaged onto any device for any purpose without departing from the principles of the invention.
申请公布号
WO2004027521(A3)
申请公布日期
2004.04.22
申请号
WO2003US29785
申请日期
2003.09.19
申请人
DMETRIX, INC.;OLSZAK, ARTUR, G.;DESCOUR, MICHAEL, R.