DEVICE AND METHOD FOR TESTING MULTI-PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a device for efficiently testing a package in which a number of semiconductor chips are mounted. SOLUTION: The device includes a test driver having at least one drive channel and at least one input/output channel, and a test board on which the package is mounted. The drive pin of each semiconductor chip is connected in parallel with the drive channel and the input/output pin of each semiconductor chip is connected in parallel with the input/output channel. COPYRIGHT: (C)2004,JPO