| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a multilayer wiring board which allows manufacturing of a thin multilayer wiring board without losing contact reliability between a conductive resin composition and a conductive circuit section, and without a decline in smoothness of the board. SOLUTION: A through hole 14 has a diameter Db in a conductive layer 13 which is larger than a diameter Da in a seed layer 12, hence making a large contact area between the conductive resin composition 15 filling the through hole 14 and the seed layer 12. Consequently, there is a good conductivity path formed between the conductive resin composition and the conductive layer 13 via the seed layer 12. COPYRIGHT: (C)2004,JPO |
