| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor element is effectively cooled. <P>SOLUTION: A metal plate 19 so arranged as to be pressurized by its end with a bolt is embedded between the bolt and a bolt 18 jointing a bus bar 13 where a semiconductor chip 11 is provided to a cooling jacket 16. As a result, the clamping pressure of the bolt 18 acts on a resin mold 14 between the bolts 18 as well through the metal plate 19, and at the same time, the pressure to the cooling member evenly acts on the entire bus bar 13. Thus, the press-contact force between the bus bar 13 and the cooling jacket 16 improves to reduce the thermal resistance between them, so the heat generated at the semiconductor chip 11 is efficiently transferred to the cooling jacket 16 through the bus bar 13. <P>COPYRIGHT: (C)2004,JPO</p> |
