| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a grinder composition capable of remarkably reducing a haze level on the surface of a semiconductor wafer, and a grinding method using the composition. <P>SOLUTION: The grinder composition is prepared by mixing silicon dioxide, an alkaline compound and a water-soluble macromolecular compound. The silicon dioxide is a colloidal silica, whose average primary particle diameter (D<SB>SA</SB>) obtained by a specific surface area measured by BET method is 5-30nm and whose average secondary particle diameter (D<SB>N4</SB>) measured by a laser scattering method is 5-120nm, or a fumed silica, whose average primary particle diameter (D<SB>SA</SB>) is 5-30nm and whose average secondary particle diameter (D<SB>N4</SB>) is 5-200nm. <P>COPYRIGHT: (C)2004,JPO</p> |
