发明名称 |
METHOD FOR PRODUCING W-Cu COMPOSITE MATERIAL THIN SHEET |
摘要 |
PROBLEM TO BE SOLVED: To produce a W-Cu composite material with a thin sheet shape which has a high thermal conductivity/a low thermal expansion coefficient, and is suitable for the heat management element of electronic equipment by eliminating complicated stages and minimizing pores inside the material. SOLUTION: In the production method for a W-Cu composite material thin sheet, a first stage where copper powder and tungsten powder are mixed to produce powder for thermal spraying in the production method for a metal-matrix composite material, and a secondary stage where the powder for thermal spraying is plasma-sprayed on a substrate to form a thin sheet are included. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004124259(A) |
申请公布日期 |
2004.04.22 |
申请号 |
JP20030329397 |
申请日期 |
2003.09.22 |
申请人 |
KOREA INST OF MACH & MATERIALS |
发明人 |
KANG SUK BONG;KAN HYUN KI |
分类号 |
B22F1/00;C23C4/08;C23C4/12;(IPC1-7):C23C4/08 |
主分类号 |
B22F1/00 |
代理机构 |
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地址 |
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