发明名称 Apparatus for processing binding film for manufacturing copper clad laminate board and circuit board
摘要 An apparatus for processing binding film is provided. The apparatus comprises a workstation board and a feeder for supplying the binding film, wherein the feeder is disposed at a front-end side of the workstation board. A separating set comprising a metering roller and a plurality of knifes, a slot-flush set comprising a plurality of flushing heads, and a knife set, are disposed at predetermined positions over the workstation board. The slot flushing, separation and cutting process steps are executed in a single step. A receiving section is disposed at a distal end side of the workstation board and behind the knife set. The processed binding film sheets are automatically received and stacked.
申请公布号 US2004074358(A1) 申请公布日期 2004.04.22
申请号 US20020274139 申请日期 2002.10.21
申请人 USUN TECHNOLOGY CO., LTD. 发明人 HUANG CHIU-FONG
分类号 H05K3/00;(IPC1-7):B26D1/56;B23D25/02 主分类号 H05K3/00
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