| 摘要 |
To provide a wafer inspecting apparatus for classifying by kind defects appearing on a patterned wafer, a wafer is inspected by a wafer defect inspecting apparatus unit and coordinate value data representing positions and sizes of defects on the sample is output thereby. The coordinate value data is supplied to an image data forming unit and graphic images representing defects on the wafer are formed for respective chips on the wafer, and image data is produced. The image data is output to a pattern overlap evaluating unit which analyzes a state of overlap of a first image corresponding to the image data and a second image representing the circuit pattern based on the wiring information and outputting overlap analysis data. A defect kind automatic classifying unit receives the overlap analysis data and classifies defects by kind of defect based on the overlap analysis data.
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