发明名称 Heat sink assembly with adjustable clip
摘要 A heat sink assembly includes a back plate (10), a clip (20) and a heat sink (50). The back plate is attached below a motherboard (60) on which a CPU (63) is mounted. The heat sink is attached on the CPU. Two posts (13) of the back plate extend through the motherboard and the heat sink. The heat sink includes a base (51) and fins (55). A longitudinal channel (57) is transversely defined through the fins. The base defines a recess (53) under the channel fittingly receiving an annular disc (58) therein. The clip includes a pressing portion (22) received in the channel, and two locking portions (29) engaging with the corresponding posts. A bolt (40) is screwed through the pressing portion to abut against the disc. By adjusting a depth to which the bolt is screwed, the clip can provide adjustable pressure acting on the heat sink.
申请公布号 US6724632(B2) 申请公布日期 2004.04.20
申请号 US20020300232 申请日期 2002.11.19
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 LEE HSIEH-KUN;LEE DONG-YUN;ZHANG ZHI-JIE
分类号 H01L23/40;(IPC1-7):H05K7/20 主分类号 H01L23/40
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