发明名称 MOLD ASSEMBLY AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To ensure that no flash is generated in the part of a hole, even when there is a slight error in the height of a pin or the surface smoothness of a cavity, when a finished product with the hole is molded by a heat cycle process. SOLUTION: A pin housing part 9 is formed in a core 5 on the movable half of a mold and a movable pin 10 for forming a hole in a molded product is housed in the pin housing part 9 in the way that the pin 10 advances into and recedes from the pin housing part 9 and protrudes into the cavity 11 passing through the part 5a of a hole. The pin housing part 9 is blocked by a lid part 12 in the state that the former houses the movable pin 10 and a spring 13 for urging the movable pin 10 is retained between the movable pin 10 and the lid part 12. During clamping the mold, the tip face of the movable pin 10 is forced to stick to the cavity surface 2a of the core 2 of a cavity-side half 1 of the mold and no gap into which the resin injected into the cavity 11 penetrates, is generated between the tip face of the movable pin 10 and the cavity surface 2a. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004114334(A) 申请公布日期 2004.04.15
申请号 JP20020277255 申请日期 2002.09.24
申请人 ONO SANGYO KK 发明人 SATO YOSHIHISA
分类号 B29C33/00;(IPC1-7):B29C33/00 主分类号 B29C33/00
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