发明名称 METHODS AND SYSTEMS FOR CONTROLLING BELT SURFACE TEMPERATURE AND SLURRY TEMPERATURE IN LINEAR CHEMICAL MECHANICAL PLANARIZATION
摘要 A linear chemical mechanical planarization (CMP) system includes a belt pad (102), a slurry bar (120) having a plurality of nozzles, and a heating module (130) for heating slurry. The heating module (130) has a plurality of heating elements, each of which is coupled in flow communication with one of the plurality of nozzles of the slurry bar. The system also may include a control system (300) for controlling the heating elements of the heating module and first and second temperature sensors coupled to the control system. The first temperature sensors (TC) measure the temperature of slurry heated by each of the heating elements, and the second temperature sensors (320a-320f) measure the temperature of the surface of the belt pad. A method for dispensing slurry in a linear CMP system, and methods for controlling the temperature of the surface of the belt pad and the temperature of slurry in a linear CMP system also are described.
申请公布号 WO2004030865(A1) 申请公布日期 2004.04.15
申请号 WO2003US30904 申请日期 2003.09.29
申请人 LAM RESEARCH CORPORATION 发明人 WU, PATRICK, P., H.;PHAM, XUYEN;NGUYEN, TUAN, A.;ZHOU, REN
分类号 B24B21/04;B24B37/015;B24B49/14;B24B57/02 主分类号 B24B21/04
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