发明名称 METHOD FOR PRODUCING EPOXY RESIN MOLDING MATERIAL OF THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin molding material having bubbles dispersed uniformly. SOLUTION: This molding material contains an epoxy resin, a phenol resin, a curing accelerator and an inorganic filler as essential components, and is produced through a process for mixing the respective components using a mixer, a first process for heating and melting the components with a heat roll to obtain a heat molten object, and a second process for heating and melting the heat molten object with the heat roll at a shearing speed of 40 /s or less. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004114561(A) 申请公布日期 2004.04.15
申请号 JP20020282493 申请日期 2002.09.27
申请人 SUMITOMO BAKELITE CO LTD 发明人 MASUDA TAKESHI
分类号 B29B11/12;B29B7/10;B29K61/04;B29K63/00;B29K105/16;C08G59/62;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):B29B11/12 主分类号 B29B11/12
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