| 摘要 |
PROBLEM TO BE SOLVED: To collect a chip component determined to be defective by an inspecting device into a recovery tray, to reset the recovery tray when the component is determined to be good by re-inspection of an operator, and to return it to a taping device again for loading onto a storage tape. SOLUTION: The recovery tray 105 or the like is fixedly mounted on a Y-table 104 which can move in X- and Y-directions, and a CPU 91 controls to collect the chip component into the tray 105 instead of mounting it onto a tape body 4A if characteristic inspection results of the component by a characteristic inspection device 81 at a first inspection station are out of a predetermined range. The recovery tray 105 is removed from the Y-table 104. The components are subjected to visual inspection by the operator and inspections by other inspection devices. A defective component is disposed of and only a good one is returned to the recovery tray 105. The tray 105 is returned to the Y-table 104. The operator restarts the taping device, and if the chip component A is determined to be good by various inspections, it is loaded into a storage recess 4B by an adsorption loading nozzle 28. COPYRIGHT: (C)2004,JPO
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