发明名称 |
Laterally interconnecting structures |
摘要 |
A method of increasing mechanical interlocking between a first structure and a second adjacent structure in an integrated circuit. The first structure is formed with a first surface having a first horizontal component, and the second structure is formed with a second surface having a second horizontal component. The first surface laterally engages the second surface and the first horizontal component is complementary to the second horizontal component, such that the first structure prohibits vertical movement of the second structure.
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申请公布号 |
US2004072421(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20020267810 |
申请日期 |
2002.10.09 |
申请人 |
YEUNG MAX M.;LAU TAUMAN T.;ALI ANWAR |
发明人 |
YEUNG MAX M.;LAU TAUMAN T.;ALI ANWAR |
分类号 |
H01L21/768;H01L23/522;H01L23/528;(IPC1-7):H01L21/20;H01L21/44 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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