| 发明名称 |
Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors |
| 摘要 |
An apparatus and method recycles the abrasive fluid or slurry effluent used in the polishing step in the manufacture of semiconductors. Agglomerations of abrasive grains built up in the slurry effluent are crushed using a mill, ultrasonic oscillation, or pressurized circulation. The slurry effluent is then regenerated and reused.
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| 申请公布号 |
US2004069878(A1) |
申请公布日期 |
2004.04.15 |
| 申请号 |
US20030675939 |
申请日期 |
2003.10.02 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
OSUDA HIROSHI;MATOBA TORU;FUKUIZUMI MASATAKA |
| 分类号 |
C02F11/12;B01D61/14;B01D61/20;B01D61/22;B01D65/02;B24B55/12;B24B57/02;H01L21/304;(IPC1-7):B02C11/08;B02C21/00 |
主分类号 |
C02F11/12 |
| 代理机构 |
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