发明名称 |
Ceramic joint body |
摘要 |
An object of the present invention is to provide a ceramic bonded body comprising a ceramic substrate and a ceramic body such as a cylindrical body firmly bonded to each other and excellent in corrosion resistance in the ceramic substrate for the use for a semiconductor product producing/examining step. The ceramic bonded body according to the present invention comprises: a ceramic substrate in which a conductor is provided; and a ceramic body bonded to a bottom face of the ceramic substrate The ceramic bonded body has a region, where no conductor is formed, in at least a part of a region above a bonding interface between the ceramic substrate and the ceramic body.
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申请公布号 |
US2004071945(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20030432639 |
申请日期 |
2003.11.06 |
申请人 |
ITO YASUTAKA;OHKURA KAZUTERU |
发明人 |
ITO YASUTAKA;OHKURA KAZUTERU |
分类号 |
C04B35/10;C04B35/565;C04B35/581;C04B35/645;C04B37/00;H01L21/00;H01L21/683;(IPC1-7):B32B3/00 |
主分类号 |
C04B35/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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