| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing optical semiconductor device by which the dispersion and uniformity of particles in a sealing resin can be improved by eliminating the need of applying the resin while stirring the resin. <P>SOLUTION: This method includes a step of placing an LED chip 3 on a lead frame 2 and electrically connecting the chip 3 to the frame 2, a step of mixing a prescribed amount of particles in a first sealing resin to a concentration at which the particles do not settle down. This method also includes a step of sealing the LED chip 3 by successively applying first and second prepared sealing resins 5 and 7 to the lead frame 2. <P>COPYRIGHT: (C)2004,JPO |
