发明名称 THERMOELEMENT MODULE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve joint yield between a thermoelement and an electrode even when there is warpage in an insulating substrate or variation in the height of the thermoelement. SOLUTION: A module is provided with; oppositely arranged insulating substrates 1, 7; electrodes 2, 8 which are, respectively, provided at the insulating substrates 1, 7; the P-type and N-type thermoelements 3, 4 which are located between the insulating substrates 1, 7 and electrically connected in series while thermally connected in parallel, with both ends jointed to the electrodes 2, 8, respectively; and holes 7a, 8a which are disposed at either one of the insulating substrates 1, 7 and at the electrode 8 of the insulating substrate 7, being permitted to communicate with each other. The ends of the thermoelements 3, 4 are inserted into the holes 7a, 8a of the insulating substrate 7 and the electrode 8, so as to be jointed to the electrode 8. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119833(A) 申请公布日期 2004.04.15
申请号 JP20020283525 申请日期 2002.09.27
申请人 TOSHIBA CORP 发明人 TATEYAMA KAZUKI;IGUCHI TOMOHIRO;MORI IKUO
分类号 H01L35/32;H01L35/08;H01L35/34;(IPC1-7):H01L35/32 主分类号 H01L35/32
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