发明名称 POLISHING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To perform high quality polishing by uniformly supplying slurry liquid from the whole of a polishing surface of a polishing device and preventing deformation of buff. <P>SOLUTION: In this device, a rotation center of a workpiece and a rotation center of a polishing plate 16 are eccentrically arranged. A buff sticking surface of the polishing plate 16 is coated with the buff made of a material for infiltrating the slurry liquid. At the inside of the polishing plate 16, flow passages 16a and 16b for supplying the slurry liquid by infiltrating the buff from an adhering surface side of the buff adhered to the buff sticking surface are provided. A plurality of slurry flow grooves 18 communicated with the flow passage 16b and formed into linear shapes to extend from a center part side of the buff sticking surface to an outer peripheral part side are provided at intervals in a peripheral direction on the buff sticking surface of the polishing plate 16. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004114183(A) 申请公布日期 2004.04.15
申请号 JP20020278289 申请日期 2002.09.25
申请人 SHINKO ELECTRIC IND CO LTD 发明人 YAMAGISHI KATSUNORI
分类号 B24B57/02;B24B37/00;H01L21/304;(IPC1-7):B24B37/00 主分类号 B24B57/02
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