| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated structure for transmission of a high frequency signal and a high frequency semiconductor package using it wherein useable frequencies are made a wide band by shifting a resonance frequency to a high frequency side. <P>SOLUTION: The laminated structure for a high frequency signal is adapted as follows: signal wiring conductors formed on an uppermost layer and a lowermost layer of a laminate substrate obtained by laminating four layers or more of dielectric layers extend oppositely from one end to one end, and one end of each signal wiring conductor and a surface layer signal penetration conductor penetrating vertically the dielectric layers of the uppermost layer and the lowermost layer are connected via a signal wiring connection conductor. Further, an inner layer grounding conductor non-formation region, which flat plane configuration provides a symmetrical configuration with respect to two axes, and an inner layer grounding conductor are formed, and among the respective layers consisting of the inner layers a dielectric of a layer positioned at a middle is made lower than that of another layer. <P>COPYRIGHT: (C)2004,JPO |
