| 摘要 |
PURPOSE: A photosensitive resin composition being suitably used as a protection film material for photo-device is provided by adding polycarboxylic anhydrides to a conventionally used epoxy-containing resin. The composition does not cause yellowing in the resulted protection film, while satisfying the properties such as adhesion to substrate, surface hardness, transparency, heat resistance, UV resistance, chemical resistance and water resistance. CONSTITUTION: The photosensitive resin composition comprises (a-1) unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, (a-2) an unsaturated epoxy-containing compound, and (a-3) a copolymer(represented as A in formula 2) prepared from olefin-based unsaturated material excepting above (a-1) and (a-2); further at least one or two polycarboxylic anhydride(s) selected from compounds of formula 1 or 2, a polymeric compound having ethylenically unsaturated bonds, and a photoinitiator.
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