发明名称 |
Semiconductor device having heat spreader attached thereto and method of manufacturing the same |
摘要 |
In a semiconductor device having a heat spreader attached thereto, a semiconductor chip is mounted on a multi-layer wiring substrate via an electrode pad and an insulating resin. The sides of the semiconductor chip on the substrate are sealed with the insulating resin, and a copper paste film contacted to the exposed surface of the semiconductor chips are formed. The copper paste film functions as a heat spreader.
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申请公布号 |
US6720650(B2) |
申请公布日期 |
2004.04.13 |
申请号 |
US20010905141 |
申请日期 |
2001.07.13 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
MIYAZAKI TAKASHI |
分类号 |
H01L23/12;H01L21/56;H01L23/34;H01L23/36;H01L23/367;H01L23/373;H01L23/433;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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