| 摘要 |
PURPOSE: A head assembly of a CMP apparatus is provided to prevent defects of a wafer due to the air leakage in a CMP process by improving the structure of the head assembly. CONSTITUTION: A head assembly of a CMP apparatus includes a head body(10), a carrier(20), a gimbal flexure(30), a membrane part, and a combination part. The carrier(20) is combined with a lower part of the head body(10). The gimbal flexure(30) is combined with a lower part of the carrier(20). The membrane part is located below the gimbal flexure in order to catch a wafer. The combination part includes a fixing pin and a screw combination portion. The fixing pin is fixed to the carrier and inserted into a pinhole. The screw combination portion fixes the fixing pin to the gimbal flexure.
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