Multilayered hybrid electronic module

摘要

The invention is related to the computer science and may be used in the design of miniature high-performance computing systems. The purpose of the invention is to increase the IC stuffing density and to reduce the microelectronic module assembly effort. The multilayered hybrid electronic module contains a backplane with multilayer wiring with ICs and sockets installed. A socket body is a box of elastic dielectric material, whose vertical walls have vertical metallized contact slots connected to the contact pads on the outer bottom surface of the socket. IC packages to be installed in the sockets have a rigid peripheral frame with cylindrical leads on the perimeter. The leads are parallel to the base of the package and lie in the same plane. Dimensions and shape of the IC package correspond to those of the socket cavity. Dimensions and positions of the IC leads correspond to those of the contact slots. IC packages may also have raised tabs for proper spacing between ICs installed in the same socket and for easier removal of ICs from the socket. Forced cooling of ICs in the socket is allowed by air passages in the socket body aligned with chip-to-chip gaps. The contact surface between socket contact slots and IC leads may be increased by using leads with larger diameter arranged in two planes in a checkerboard pattern.