POWER MODULE COMPRISING TWO SUBSTRATES AND METHOD FOR PRODUCING THE SAME

摘要

The invention relates to a power module (3) and a method for producing the same. Said power module (3) comprises a first substrate (1) which is provided with power semiconductor chips (4) and a second substrate (2) which is fitted with signal semiconductor chips (5). Said substrates (1) and (2) are aligned one above the other in a parallel manner, their component sides (7) and (8) being arranged in relation to each other. The second substrate (2) is held at a defined distance (d) from the first substrate (1) by means of contacting wire (9) which is bent in the form of a hinge, and is mechanically fixed and electrically connected in a plastic housing (18).