| 发明名称 |
Process for the structured selective metallization of a surface of a substrate comprises preheating the substrate to a temperature below the deposition temperature of a predetermined metal and depositing the metal in predetermined regions |
| 摘要 |
<p>Process for the structured selective metallization of a surface of a substrate (10) comprises preheating the substrate to a temperature below the deposition temperature of a predetermined metal dissolved in a fluid provided above the surface of the substrate, and depositing the metal in predetermined regions (19) on the surface of the substrate by locally raising the temperature on the surface of the substrate above the deposition temperature.</p> |
| 申请公布号 |
DE10245928(A1) |
申请公布日期 |
2004.04.08 |
| 申请号 |
DE2002145928 |
申请日期 |
2002.09.30 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
SCHMID, GUENTER |
| 分类号 |
C23C18/16;H01L21/288;H01L21/60;H01L21/768;H05K3/18;(IPC1-7):C23C18/18 |
主分类号 |
C23C18/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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