发明名称 HIGH-FREQUENCY ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a high-frequency electronic component which is a small-sized and high-performance component and resultantly a component excelling in a total electric characteristic, by using a plurality of layers comprising at least a hybrid-resin board layer having an enough high dielectric constant, a hybrid-resin board layer having an enough low dielectric constant, a hybrid-resin board layer having an enough high permeability, and a hybrid-resin board layer having an enough high Q. <P>SOLUTION: The high-frequency electronic component comprises a laminated electronic component 210 having two or more kinds of constituent layers formed out of hybrid materials. In at least one layer of the hybrid materials, conductor layers 262 to 266 are so formed as to constitute predetermined electric circuits out of the conductor layers, and semiconductor components 261 are mounted on the surface of the high-frequency electronic component. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004111908(A) 申请公布日期 2004.04.08
申请号 JP20030153897 申请日期 2003.05.30
申请人 TDK CORP 发明人 TAKATANI MINORU;ENDO TOSHIICHI
分类号 H05K1/16;H01F17/04;H01G4/20;H01G4/40;H01L23/12;H01L23/14;H05K3/46;(IPC1-7):H01L23/12 主分类号 H05K1/16
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