| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces the space utilized, when mounting a semiconductor element without causing deterioration of element characteristics. SOLUTION: The semiconductor element comprises an air bridge formed so as to coat an element, such as FBAR or the like formed on a surface of a semiconductor substrate via an air gap. The semiconductor device is sealed with a resin, having the air gap for forming the air bridge. COPYRIGHT: (C)2004,JPO |
