| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board for achieving high wiring density and a high flexibility in design, short manufacturing lead time, and ensuring stiffness, and to provide a method for manufacturing the wiring board. <P>SOLUTION: In the wiring board, an insulating support substrate 1 and resin substrates 2, 3 are laminated. The insulating support substrate 1 ensures stiffness. In the resin substrates 2, 3, a wiring circuit is formed. The resin substrates 2, 3 are made of thermoplastic resin. <P>COPYRIGHT: (C)2004,JPO</p> |
