| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film with improved punching property by suppressing happening of burrs and scraps in punching process and to provide a polyimide film for lead frames and a surface mounted area array packages by using the film. SOLUTION: The polyimide film is obtained from the polyimide which imparts a film satisfying either one of the thickness is 45-55μm then the L value is 40-75 or thickness is 70-80μm then the L value is 30-65, and the lead frames and the surface mounted area array packages are obtained from the film. COPYRIGHT: (C)2004,JPO |
