| 摘要 |
PROBLEM TO BE SOLVED: To provide an additive for an acid copper plating bath with which the formation of pits in a plating film is suppressed, and aid copper plating can be carried out with high reliability, to provide an acid copper plating bath comprising the additive, and to provide a plating method using the plating bath. SOLUTION: The additive for an acid copper plating bath comprises an anthraquinone based compound expressed by formula (1) [in the formula, each of R<SP>1</SP>, R<SP>2</SP>and R<SP>3</SP>is the same or different, and denote a hydrogen atom, a hydroxyl group, a sulfone group or an amino group; R<SP>4</SP>and R<SP>5</SP>each is a hydrogen atom, an amino group or a group-NHR' (R' is a phenyl group which may be substituted, a phenyl alkyl group which may be substituted, a phenyl amino group which may be substituted or an anthraquinonyl group which may be substituted); R<SP>6</SP>denotes a hydrogen atom, a hydroxyl group, a 1 to 20C alkyl group or a sulfone group, respectively; and A denotes an oxygen atom or forms a group (CH-CO-NCH<SB>3</SB>-)together with R<SP>4</SP>] or the salt thereof. The acid copper plating bath comprises the additive. The plating method uses the plating bath. COPYRIGHT: (C)2004,JPO
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