| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability in semiconductor die attach paste having high adhesiveness and quick curing, and especially in solder crack resistance or the like. <P>SOLUTION: The die attach paste for a semiconductor contains an epoxy resin (A), an epoxy resin curing agent (B), a liquid elastomer (C) having a number average molecular weight of 500-5,000 and containing epoxy groups, polybutadiene (D) having a number average molecular weight of 500-5,000 and containing methacrylic groups or acrylic groups, a compound (E) having double bonds capable of at least one radical polymerization in one molecule, a radical polymerization catalyst (F), a coupling agent (G), and a filler (H) as essential components. In the component (A), the epoxy resin shown by formula 1 is 50 wt%. The component B consists of at least two compounds or more selected from imidazole compounds and polyphenol compounds having two or more hydroxyl groups in a molecule. the total amount of components (A) and (B) in all resin components excluding the component (H) is 40-80 wt% and each of the components (C), (D) is 3-20 wt% of all the resin components. <P>COPYRIGHT: (C)2004,JPO</p> |
