发明名称 |
Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials |
摘要 |
The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
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申请公布号 |
US2004065954(A1) |
申请公布日期 |
2004.04.08 |
申请号 |
US20030670319 |
申请日期 |
2003.09.26 |
申请人 |
WEISER MARTIN W.;DEAN NANCY F.;CLARK BRETT M.;BOSSIO MICHAEL J.;FLEMING RONALD H.;FLINT JAMES P. |
发明人 |
WEISER MARTIN W.;DEAN NANCY F.;CLARK BRETT M.;BOSSIO MICHAEL J.;FLEMING RONALD H.;FLINT JAMES P. |
分类号 |
B23K35/02;B23K35/26;C22B13/06;C25C1/18;H01L23/31;H01L23/485;H01L23/498;H05K3/34;(IPC1-7):H01L23/48 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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