PACKAGING MODULE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC EQUIPMENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To miniaturize with respect to a packaging module and a manufacturing method thereof. SOLUTION: The packaging module includes a resin main body 1 and a plurality of electronic parts 2 having a part thereof are buried. The electronic parts 2 comprises an electrode 3 exposed outside of the main body 1, and the part of this electrode 3 exposed outside the main body 1 has a connection electrode 4 by a conductive paste. Consequently, electrical and mechanical connection with the electrode of the packaging module surely done by additionally bonding the conductive paste on the electrode of a board side with easily miniaturizing without the need of a drawing electrode to be placed separately. COPYRIGHT: (C)2004,JPO