发明名称 Heat conductive silicone rubber composite sheet
摘要 The present invention provides a heat conductive silicone rubber composite sheet that is suitable as a heat dissipating member provided between a heat generating electronic component and a heat dissipating component such as a heat dissipating fin, wherein the heat conductive silicone rubber composite sheet has a laminated structure with good electrical insulation and thermal conductivity, as well as excellent strength, flexibility, and particularly superior interlayer adhesion. The laminated structure has an intermediate layer and a pair of outer layers laminated to both surfaces of the intermediate layer, wherein (A) the intermediate layer is a layer of a synthetic resin film that displays heat resistance and electrical insulation, and (B) the outer layers are silicone rubber layers formed by curing a composition including (a) an organopolysiloxane, (b) a curing agent, (c) a heat conductive filler, and (d) a silicon compound-based adhesion imparting agent with at least one functional group selected from the group consisting of epoxy groups, alkoxy groups, vinyl groups, and the group represented by the formula Si-H.
申请公布号 US2004067372(A1) 申请公布日期 2004.04.08
申请号 US20030667671 申请日期 2003.09.23
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 TAKEI HIROSHI;SUZUKI AKIO
分类号 B32B25/20;B32B25/04;B32B25/08;C08K3/00;C08K5/54;C08L83/04;(IPC1-7):B32B9/04 主分类号 B32B25/20
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