发明名称 Method and a mold to arrange features on a substrate to replicate features having minimal dimensional variability
摘要 The present invention is directed to a method of and a mold for arranging features on a substrate to replicate the features with minimal dimensional variability. The method includes arranging features on a layer to minimize thickness variations in the layer that are attributable to density variations of the plurality of features on the layer. The features are transferred into an underlying substrate. It is believed that by forming the features so as to define a uniform fill factor in the layer, the thickness variations may be reduced, if not abrogated. To that end, one method in accordance with the present invention includes forming a flowable material on the substrate. Thereafter, a plurality of features is formed in a region of the flowable material. The plurality of features are arranged to provide a substantially uniform fill factor in the region.
申请公布号 US2004065976(A1) 申请公布日期 2004.04.08
申请号 US20020264960 申请日期 2002.10.04
申请人 SREENIVASAN SIDLGATA V.;WATTS MICHAEL P.C. 发明人 SREENIVASAN SIDLGATA V.;WATTS MICHAEL P.C.
分类号 B29C35/08;B29C59/02;G03F1/00;G03F7/00;(IPC1-7):B29C35/08 主分类号 B29C35/08
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