| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflowing apparatus which mainly heats only a cream solder when a printed board in which only a necessary part of a rear surface of the board is coated with the solder, is treated, which remarkably reduces a space necessary to heat as compared with a prior art by drawing a circle in a horizontal direction in treatments of preheating, mainly heating and cooling and which reduces the amount of nitrogen gas leaked by inputting and outputting the board only at one port using an inlet and an outlet as a common utility as much as possible. SOLUTION: A space for supply and also for take-out 5, heat insulation 6, 7, and 8 for preheating, a heat insulation chamber 9 for main heating, and heat insulation chambers 10, 11 for cooling are provided in parallel at an equal interval so as to draw the circle in a horizontal plane in a box-shaped base frame 1 having a printed board exit/entrance 4 provided at a sidewall. A hot plate 13 is installed in a lower section than a position for tuning a support frame of a printed board transferring unit in the heat insulation chamber for preheating and the heat installation chamber for cooling. A heating means 14 for spraying a hot blast of a required temperature from a hot blast spraying cylinder is installed in the heat insulation chamber for main heating. The printed board transferring unit 20 which is intermittently rotated in the horizontal direction is installed at the center of the base frame, and support frames 21 which enter the space for supply and also for take-out, the heat insulation chamber for preheating, the heat insulation chamber for main heating and the heat insulation chamber for cooling are radially mounted. COPYRIGHT: (C)2004,JPO
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