| 摘要 |
PROBLEM TO BE SOLVED: To mass-produce an integrated circuit on a flexible web sheet substrate by utilizing an embossing process. SOLUTION: Many embossed, cured, and etched layers are provided on a flexible substrate to use the layers in a PIRM intersecting point memory array. The intersecting point array is manufactured in a roll-to-roll environment utilizing a plastic web in accordance with an improved embossing lithographic technique which provides required high precision and high throughput and conquests the normal limit of the conventional patterning technique. In addition, the manufacturing process of a digital circuit can be remarkably simplified when embossing lithography is used as the patterning method used on the flexible substrate. The embossing lithography can yield a relatively high throughput, provide the ability of patterning a wide ranges of materials and high resolution. COPYRIGHT: (C)2004,JPO
|
