| 摘要 |
PROBLEM TO BE SOLVED: To specify the cause of defects on the surface of a semiconductor wafer and to precisely evaluate the semiconductor wafer. SOLUTION: The defect on the surface of the semiconductor wafer is detected before a semiconductor wafer processing. A position of the defect is obtained as position information and the image of the defect is obtained as pre-processing image information. The semiconductor wafer processing is performed, and the image of a part, where the defect exists before the semiconductor wafer processing, is obtained as post-processing image information, based on position information obtained before the semiconductor wafer processing. The images before and after the semiconductor wafer processing at the same point on the surface of the semiconductor wafer are obtained. COPYRIGHT: (C)2004,JPO
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