| 摘要 |
On its underside, the intermediate support has bumps (22) which are integrally moulded from plastic, in a single piece, for contacting on a printed-circuit board. In order to relieve the mechanical load on the bumps, bracket-shaped support bumps (26) are arranged preferably in the side and corner areas, these support bumps being soldered on the printed circuit board in the same way as the contact bumps. This considerably increases the thermal-mechanical reliability of the semiconductor module. |
